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19-1614; Rev 0; 6/00
L MANUA ION KIT ALUAT DATA SHEET EV WS FOLLO
SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package
General Description Features
o +2.7V to +5.5V Single Supply o Low Operating Current 8.5mA for High Linearity 4.5mA for Paging 4.1mA in Low-Gain, High-Linearity Mode o Low Noise Figure: 1.5dB Cellular o Adjustable IIP3 o Two Gain Settings o < 1A Shutdown Mode o Ultra-Small 6-Bump UCSP (1mm x 1.5mm)
MAX2374
The MAX2374 silicon-germanium (SiGe), switchablegain, variable-linearity, low-noise amplifier (LNA) is designed for cellular-band, code-division multipleaccess (CDMA). It can be used for applications such as TDMA and PDC or wherever high dynamic range and low noise are required. This LNA provides a high intermodulation intercept point (IIP3), which is adjustable to meet specific system requirements by selecting an appropriate external resistor. To achieve high gain and low noise, the LNA is packaged in a tiny ultra-chip-scale package (UCSP) with six solder bumps. The LNA operates from a +2.7V to +5.5V single supply and consumes just 8.5mA while achieving a +6.2dBm input IIP3. Supply current reduces to less than 1A in shutdown mode. The MAX2374 provides two gain modes. High-gain mode optimizes system sensitivity, while low-gain mode optimizes system linearity.
Applications
CDMA Phones TDMA Phones Wireless Local Loop (WLL) GSM Handsets Land Mobile Radio Wireless Data
Pin Configuration appears at end of data sheet. MAX2374EBT PART
Ordering Information
TEMP. RANGE -40C to +85C PINPACKAGE 6 UCSP* TOP MARK AAB
*UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this data sheet for more information.
Typical Application Circuit
VCC = + 2.75V 100pF
A3
GND
VCC
B3 8.2nH B2 VCC
5pF LNA INPUT
0.01F
A2
MAX2374
LNAIN LNAOUT
2pF LNA OUTPUT
A1 6.8nH GAIN-CONTROL LOGIC OUTPUT
GAIN
BIAS
B1 RBIAS
________________________________________________________________ Maxim Integrated Products
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +6.0V GAIN, BIAS Voltage to GND...................-0.3V to (VCC + 0.3V) GAIN, BIAS Current ......................................................10mA RF Input Power LNAIN .........................................................................+10dBm LNAOUT to GND ....................................-0.3V to (VCC + 0.6V) Continuous Power Dissipation (TA = +85C) ...................540mW Operating Temperature Range MAX2374 .........................................................-40C to +85C Storage Temperature.........................................-65C to +150C Junction Temperature ......................................................+150C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, RBIAS = 20k, VGAIN = high, LNAOUT = VCC, no input signals at LNAIN, TA = -40C to +85C. Typical values are at VCC = +2.75V, TA = +25C, unless otherwise noted.) (Note 1) PARAMETER SUPPLY Supply Voltage VCC = 2.75V VCC = 5.5V Supply Current RBIAS = 10k RBIAS = 43k GAIN = 0.6V, VCC = 2.75V Shutdown Supply Current GAIN CONTROL INPUT Input Logic Voltage High Input Logic Voltage Low Input Current BIAS Pin Voltage (Note 2) -5 VCC 1.16 1.5 0.6 5 V V A V BIAS = open circuit 2.7 8.5 10.5 15 4.5 4.5 0.1 5.5 1 A mA 5.5 10.5 V CONDITIONS MIN TYP MAX UNITS
AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 20k, TA = +25C. Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2) PARAMETER Recommended Operating Frequency Range (Note 3) Input and Output Return Loss Reverse Isolation Output 1dB Compression Maximum Stable Load VSWR Input and output ports externally matched to 50 VGAIN = high VGAIN = low VCC = 2.75V All modes, f 6.5GHz VGAIN = high VGAIN = low 10:1 CONDITIONS MIN 750 14 -20 -9 6 -3.5 TYP MAX 1000 UNITS MHz dB dB dBm
2
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package
AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 18k, TA = +25C. Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2) PARAMETER HIGH-GAIN MODE (GAIN = VCC) Gain Noise Figure Input Third-Order Intercept Point (Note 4) LOW-GAIN MODE (GAIN = GND) Gain Noise Figure RBIAS = 10k Input Third-Order Intercept Point (Note 4) MAX2374 RBIAS = 20k RBIAS = 43k Note 1: Note 2: Note 3: Note 4: 5.8 TA = -40C to +85C TA = +25C TA = -40C to +85C 0.4 -1 3 10.5 7.2 1 dBm 1.2 2 3.5 3.5 dB dB TA = +25C TA = -40C to +85C VCC = 2.75V RBIAS = 10k MAX2374 RBIAS = 20k RBIAS = 43k 4.5 13.8 12.5 1.5 7.2 6.2 4.2 dBm 15 15.6 17 1.7 dB dB CONDITIONS MIN TYP MAX UNITS
MAX2374
Production tested at TA = +25C. Maximum and minimum limits are guaranteed by design and characterization. Guaranteed by design and characterization. Operation over this frequency range is possible with a matching network tuned to the desired operating frequency. Measured with two-tone test with PLNAIN = -25dBm per tone, f1 = 881MHz, f2 = 881.9MHz.
Typical Operating Characteristics
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20k, TA = +25C, unless otherwise noted.)
ICC vs. VCC AND TEMPERATURE
MAX2374-01
S21, S11, S22, S12 vs. FREQUENCY
MAX2374-03
S21, S11, S22, S12 vs. FREQUENCY
VCC = 2.75V GAIN = GND
MAX2374-04
12 TA = +85C TA = +25C 10
RBIAS = 20k
20
VCC = GAIN = 2.75V
5
10 S21 MAGNITUDE (dB) 0 S11 -10 S22 MAGNITUDE (dB)
0 S22 -5 S21
ICC (mA)
8
GAIN = VCC
TA = -40C TA = -40C
-10 S12
6
TA = +85C TA = +25C
GAIN = GND -20 S12 -15 S11
4 2.5 3.0 3.5 4.0 VCC (V) 4.5 5.0 5.5
-30 750 800 850 900 950 1000 FREQUENCY (MHz)
-20 750 800 850 900 950 1000 FREQUENCY (MHz)
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20k, TA = +25C, unless otherwise noted.)
GAIN vs. RBIAS AND TEMPERATURE
MAX2374-05
IIP3 vs. RBIAS AND TEMPERATURE
A B 15 = VGAIN = GND = VGAIN = VCC TA = +85C A 10 TA = -40C B 5 B 0 VCC = 2.75V, f = 881MHz, 882MHz TA = +25C TA = -40C
MAX2374-06
20 TA = -40C 15 GAIN = VCC 10 TA = +85C TA = +25C
20
VCC = 2.75V TA = -40C TA = +85C GAIN = GND TA = +25C
5
IIP3 (dBm)
GAIN (dB)
TA = +25C TA = +85C
0 5 15 25 RBIAS (k) 35 45
0
20 RBIAS (k)
40
60
NOISE FIGURE vs. FREQUENCY
MAX2374-07
CURRENT vs. VOLTAGE AND RBIAS
RBIAS = 10k, GAIN = VCC 15 RBIAS = 10k, GAIN = GND RBIAS = 20k, GAIN = VCC ICC (mA) 10
MAX2374-08
4.5 4.0 NOISE FIGURE (dB) 3.5 3.0 2.5 2.0 GAIN = VCC 1.5 1.0 750 800 850 900 950
20
VCC = 2.75V
5
RBIAS = 43k, GAIN = VCC RBIAS = 20k, GAIN = GND RBIAS = 43k, GAIN = GND
0 1000 2.5 3.0 3.5 4.0 VCC (V) 4.5 5.0 5.5 FREQUENCY (MHz)
Pin Description
PIN A3 A2 A1 B1 B2 B3 4 NAME GND LNAIN GAIN BIAS LNAOUT VCC Ground LNA Input Port. Blocking capacitor is required, which may be used as part of the matching network. Gain-Control Logic Input. Drive high for high-gain mode. Drive low for low-gain mode. LNA Bias Setting Pin. For nominal bias, connect 20k resistor to VCC. Adjust the resistor value to alter the linearity of the LNA. LNA Output Port. This port requires an external pullup inductor, which may be used as part of the matching network. Supply Voltage Input. Bypass with a 100pF capacitor to GND. FUNCTION
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374
Table 1a. S-Parameters (VCC = VGAIN = 2.75V)
FREQ (MHz) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 S11 MAGNITUDE 0.929 0.728 0.571 0.524 0.529 0.568 0.612 0.639 0.652 0.664 0.691 0.716 0.72 ANGLE -11.89 -49 -77.5 -101 -123.7 -145.2 -165 176 163 149 139 125 111.5 12.84 9.83 6.19 4.21 3.12 2.38 1.77 1.46 1.07 1.01 0.892 0.781 0.662 S21 MAGNITUDE ANGLE -151.3 122.73 79.42 49.35 24.18 1 -19.2 -35 -51 -60.5 -77 -91.7 -104 0.007 0.026 0.041 0.053 0.06 0.063 0.057 0.061 0.094 0.161 0.1 0.078 0.074 S12 MAGNITUDE ANGLE 123.5 69 47.6 33.3 21 11.19 5.042 15 17 -12.9 -45.4 -37 -33.3 0.908 0.842 0.728 0.68 0.671 0.68 0.704 0.732 0.697 0.626 0.689 0.693 0.686 S22 MAGNITUDE ANGLE 78.8 -20.2 -54.8 -81 -105 -128 -150 -171 162 158.7 146.5 128 110
Table 1b. S-Parameters (VCC = 2.75V, VGAIN = GND)
FREQ (MHz) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 S11 MAGNITUDE 0.987 0.916 0.8 0.75 0.754 0.782 0.803 0.811 0.797 0.739 0.745 0.701 0.591 ANGLE -8.93 -42.4 -77 -106 -132.7 -158 180 159.5 141.5 126.3 112 92.4 73 1.25 1.21 1 0.772 0.583 0.429 0.301 0.228 0.148 0.196 0.156 0.096 0.112 S21 MAGNITUDE ANGLE -148.7 128.8 72.4 28.18 -6.87 -34.5 -54 -66 -66 -62 -89 -83 -73.48 0.01 0.06 0.14 0.189 0.2 0.184 0.146 0.117 0.096 0.175 0.123 0.082 0.103 S12 MAGNITUDE ANGLE 127 85.7 52.2 19.6 -9.33 -30.7 -47 -53.4 -42.5 -47 -77.2 -63.3 -62.8 0.374 0.471 0.596 0.659 0.689 0.694 0.695 0.681 0.629 0.534 0.623 0.6 0.566 S22 MAGNITUDE ANGLE 85.8 1.23 -42 -82 -117.3 -147.5 -173 164.6 141.7 140 126.35 103.2 85.8
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374
Pin Configuration
TOP VIEW (BUMPS ON BOTTOM)
MAX2374
A3 B3 VCC
GND
LNAIN
A2
B2
LNAOUT
pad size of 0.25mm (~10mil) and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Connect multiple vias from the ground plane as close to the ground pins as possible. Install capacitors as close as possible to the IC supply voltage pin and supply end of the series inductor. Place the ground end of these capacitors near the IC GND pins to provide a low-impedance return path for the signal current.
GAIN
A1
B1
BIAS
Prototype Chip Installation
Alignment keys on the PC board around the area where the chip is located will be helpful in the prototype assembly process. It is better to align the chip on the board before any other components are placed, and then place the board on a hot plate or hot surface until the solder starts melting. Remove the board from the hot plate without disturbing the position of the chip, and let it cool down to room temperature before processing the board further.
UCSP
Detailed Description
The MAX2374 SiGe LNA is packaged in a UCSP package in order to deliver high gain, high linearity, and low noise in the smallest package possible. The special feature of this LNA is that its linearity is adjusted by an external resistor, RBIAS. The LNA has two digitally controllable gain modes to increase system dynamic range. Digital high at GAIN selects the high-gain mode, and digital low selects the low-gain mode. Adjust the LNA bias current to control the amplifier's linearity. The resistor RBIAS connected between BIAS and VCC controls the LNA current. The amplifier's linearity is directly related to the operating current. Increasing the bias current of the LNA increases the IIP3. VBIAS is approximately constant at VCC - 1.16V. Connecting a resistor from BIAS to VCC results in a supply current that can be calculated as follows: VCC = (High Gain) ~ (150 - 1.16V) / RBIAS - IBIAS can be set by a fixed resistor to VCC as described above, or it can be generated with a switched network. To operate the LNA in high-gain/high-linearity mode, set RBIAS = 20k and drive GAIN high. Do this in the presence of a transmit signal to minimize cross-modulation. To operate the LNA in low-gain/low-linearity mode, set RBIAS = 43k and drive GAIN high. This mode draws less current and should be used in the absence of a transmit signal (paging mode). Shutdown of the IC is accomplished by switching RBIAS to open circuit.
UCSP Reliability
The ultra-chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally well as a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP package. Performance through operating-life test and moisture resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for UCSP packages. UCSPs are attached through direct solder contact to the user's PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Comprehensive reliability tests have been performed and are available upon request. In conclusion, the UCSP performs reliably through environmental stresses.
Marking Information
AAA AAA ORIENTATION PRODUCT ID CODE LOT CODE
Layout Issues
Design the layout for the IC to be as compact as possible to minimize the parasitics. The chip-scale IC package uses a bump pitch of 0.5mm (19.7mil) and bump diameter of 0.3mm (~12mil). Therefore, lay out the solder-pad spacing on 0.5mm (19.7mil) centers, using a
6
Chip Information
TRANSISTOR COUNT: 296
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package
Package Information
6L,UCSP.EPS
MAX2374
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SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374
NOTES
8
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